報告題目: Electrical Discharge Machining of Reaction Bonded Silicon Carbide
報 告 人: Dr. Liew Pay Jun, Universiti Teknikal Malaysia Melaka (UTeM)
報告時間：2018年6月13日上午9:00
報告地點：機械制造系712會議室（機械材料館）
歡迎從事超精密加工、非傳統加工方向的老師和學生參加。同時，Dr. Liew Pay Jun是其所在大學的國際交流中心副主任，也歡迎對出國學習和交流感興趣的師生參加。
報告人簡介：
Dr. Liew Pay Jun, Deputy Director of International Centre, UTeM. Liew Pay Jun received her B.Eng Mechanical (Manufacturing) Engineering from Kolej Universiti Teknologi Tun Hussein Onn in 2006 and M.Sc. Manufacturing Systems Engineering from Coventry University, UK in 2007. Later in 2013, she completed her Ph.D in Mechanical Systems and Design from Tohoku University, Japan. She is now the Deputy Director of International Centre at Universiti Teknikal Malaysia Melaka (UTeM). Her research works include micro/nano machining, non-traditional machining and nanofluid assisted machining.
